Product advantages: fast delivery, free samples,products with RoHS certification, laser soldering process, cycle life of more than 300,000 times, guaranteed after-sales service, technical support and good service attitude
Application fields:Computer USB external port, charging equipment,instruments and equipment, consumer electronics, household appliances, security products
Factory strengths: with 13 years of industry experience, the company has passed ISO9001 certification, a number of patent certificates, more than 5300 cooperative customers, many customers of listed companies, 106 employees, 12 hardware punches, 18 injection molding machines, 26 full-automatic assembly machines, 32 full-automatic testing machines, 21 semi-automatic testing machines, 12 life testing machines and 25 other testing equipment
NOTES:
1.Material Specification:
1)INSULATION MATERIAL THERMOPLASTIC.
2)SHELL:COPPER ALLOY/SPCC,T:0.30mm
PLATING:NICKEL
3)TERMINAL:COPPER ALLOY,T:0.25mm
PLATING:GOLD/TIN PLATED.
2.ELECTRICAL CHARACTERISTIC:
1)INSULATION RESISTANCE:100MΩ MIN.
2)CONTACT RESISTANCE:30mΩ MAX.
3)WITHSTANDING VOLTAGE:500V AC.
3.MECHANICAL CHARACTERISTICS:
1)INSERTION FORCE:3.57Kgf MAX.
2)EXTRACTION FORCE:1.02Kgf MIN.
ORDERING INFORMATION
Storage environment: dry room temperature environment, avoid contact with acid and humid climate
STANDARD ATMOSPHEIC CONDITIONS:UNLESS OTHERWISE SPECIFIED THE STANDARD RANGE OF ATMOSPHERIC CONDITIONS FOR MAKING MEASUREMENTS AND TESTS ARE AS FOLLOWS:
(1) BETWEEN BODY AND CONDUCTOR: 5ºC TO 35℃
(2) BETWEEN CONDUCTORS NOT TO BE CONTACT：45% TO 85%
(3) PRESSURE：86Kpa TO 106Kpa
SOLDERABILITY TEST:THE TOP OF THE TERMINALS SHALL BE DIPPED 1mm IN THE SOLDER BATH OF 250±5℃ FOR 5±0.5 SECONDS
RESISTANCE TO SOLDERING HEAT TEST:
REFLOW SOLDERING CONDITIONS:
PREHEAT:TEMPERATURE ON THE COPPER FOIL SURFACE SHOULD REACH 180 .120 ℃ S AFTER THE P.C.B ENTERED INTO THE SOLDERING EQUIPMENT.
TALLEST TEMPERATURE:TEMPERATURE ON THE COPPER FOIL SURFACE SHOULD REACH THE PEAK TEMPERATURE OF 260±5 WITH IN 20 SECONDS. ℃
SOLDERING IRON METHOD: BIT TEMPERATURE 330±5℃ APPLICATION TIME OF SOLDERING IRON3±0.5 SEC HOWEVER EXCESSIVE PRESSURE SHALL NOT BE APPLIED TO THE TERMINAL
